OEM/ODM Lamination Service for PCBA Package  -Durable & Customizable Embedded Electronics Processing

A patented advanced lamination process to package different types of PCBA with components such as module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

Core Technologies:
• Find My Tags 
• Ultra-Thin NFC Cards 
• Solar-Powered E-Ink Labels 
• Fingerprint-Embedded PCBA

Key Advantages in Educational Settings:

1. Real-Time Information Updates

• Display class schedules, exam timetables, or room changes instantly via wireless updates (Wi-Fi).

• Emergency alerts (e.g., campus closures) pushed directly to the badge.

2. Enhanced Security & Access Control

• Dormitory/lecture hall access.

• Library book checkouts.

• Cashless payments at canteens/stores.

• Integrate NFC/RFID for:

3. Sustainability & Cost Savings

• Eliminates plastic waste from yearly ID reprints.

• Ultra-low power consumption: Months of use per charge (no daily charging).

4. Improved Convenience

• Multi-purpose use: Combines ID, schedule tracker, and digital wallet in one device.

• Sunlight-readable screen—no glare outdoors.

5. Customization & Branding

• Schools can display logos, event promotions, or achievement badges (e.g., "Honor Roll").

• Support for QR codes (attendance scanning, lab equipment sign-outs).